每日英語跟讀 Ep.K589: Japanese Prime Minister Invites TSMC Chairman for a Rare Meeting
Taiwanese Semiconductor Manufacturing Co (TSMC) Chairman, Mark Liu, has received an invitation to meet with Japanese Prime Minister Fumio Kishida in Japan. This meeting is particularly noteworthy as it is uncommon for top executives from major semiconductor companies worldwide to convene in a single location. TSMC confirmed Liu's attendance at the meeting but provided no further details.
台灣積體電路製造股份有限公司（TSMC）董事長劉德音收到了邀請，將與日本首相岸田文雄在日本會面。這次會議非常引人注目，因為全球主要半導體公司的高層很少聚集在一個地方。台積電證實劉德音將出席會議，但沒有提供進一步的細節。
According to reports, executives from several prominent global semiconductor firms, including TSMC, Micron Technology Inc, Applied Materials Inc, International Business Machines Corp, Intel Corp, Samsung Electronics Co, and Belgium's semiconductor research group Interuniversity Microelectronics Centre, have been invited to the discussions at the prime minister's office. The gathering of top executives from these industry leaders is an exceptional occurrence.
根據報導，多家知名的全球半導體公司的高管，包括台積電、美光科技公司、應用材料公司、IBM、英特爾、三星電子和比利時的半導體研究機構IMEC，受邀參加首相辦公室的討論。這些行業領導者的高層聚會是個罕見特例。
Japanese Prime Minister Fumio Kishida, along with Japanese Minister of Economy, Trade and Industry Yasutoshi Nishimura and other senior officials, will attend the meeting. The focus of the discussions will be to strengthen Japan's economic security and enhance the country's semiconductor supply chain. During the meeting, the executives are expected to outline their investment and business development plans in Japan.
日本首相岸田文雄將與日本經濟產業省大臣西村康稔和其他高級官員一起出席會議。討論的焦點將是加強日本的經濟安全和提高該國的半導體供應鏈。在會議期間，高管們預計將概述他們在日本的投資和業務發展計劃。
Recognizing the importance of collaboration, Japanese Chief Cabinet Secretary Hirokazu Matsuno emphasized that achieving semiconductor supply chain resilience requires the concerted efforts of like-minded nations and regions, rather than relying on individual countries alone. The meeting aligns with the growing calls from the United States for its allies to work together in addressing challenges posed by China in the semiconductor industry and other technological domains.
日本內閣官房長官松野博一認識到半導體供應鏈的重要性，強調實現半導體供應鏈的彈性需要志同道合的國家和地區共同努力，而不僅僅依賴個別國家。此次會議與美國呼籲其盟友共同應對中國在半導體和其他技術領域帶來的挑戰之警示相吻合。
TSMC's commitment to Japan is evident through its ongoing endeavors in the country. The company is constructing a wafer fab in Kumamoto, Japan, with plans for commercial production next year. Additionally, TSMC established the TSMC Japan 3DIC R&D Center, a subsidiary aimed at developing advanced integrated circuit packaging and testing services, to provide comprehensive solutions to customers utilizing the chipmaker's cutting-edge chips. The subsidiary's clean room facility was inaugurated in June of last year. TSMC's dedication to innovation extends beyond the conventional path of shrinking transistor sizes, as it aims to drive semiconductor technology forward through system-level advancements that enhance computing performance and enable increased functionality.
台積電通過在日本的持續努力表明其對該國的承諾。該公司正在日本熊本建設晶圓廠，計劃於明年進行商業生產。此外，台積電成立了TSMC日本3DIC研發中心，該子公司旨在開發先進的集成電路封裝和測試服務，為使用該公司先進芯片的客戶提供全面的解決方案。該子公司的無塵室設施在去年6月揭幕啟用。台積電對創新的奉獻不僅僅限於傳統的晶體管尺寸縮小路徑，它還旨在通過系統級進展推動半導體技術的發展，提升計算性能並實現功能的增加。
Reference article: https://www.taipeitimes.com/News/biz/archives/2023/05/18/2003799976